The ESSDERC’2019 conference will have following sessions. Detailed programme will be posted after Technical Programme Committee meeting.
CMOS Devices and Technology
CMOS scaling; Novel MOS device architectures; Circuit/device interaction and co-optimization; High-mobility channel devices; CMOS front-end or back-end processes; Interconnects; Integration of RF or photonic devices; 3D integration; Front-end and back-end manufacturing processes; 3D integration and wafer-level packaging; Reliability and characterization of materials, processes and devices; Advanced interconnects; ESD, latch-up, soft errors, noise and mismatch behavior, hot carrier effects, bias temperature instabilities, and EMI; Defect monitoring and control; Metrology; Test structures and methodologies; Manufacturing yield modeling, analysis and testing.
Opto-, Power and Microwave Devices
New device or process architectures; New phenomena and performance improvement of optoelectronic, high voltage, smart power, IGBT, microwave devices; Passive devices, antennas and filters (including Si, Ge, SiC, GaN); Optoelectronic devices including sensors, LEDs, semiconductor lasers; Photovoltaic devices; Studies of high temperature operation; IC cooling and packaging aspects; Reliability and characterization of materials, processes and devices.
Physical Modeling of Materials and Devices
Numerical, analytical and statistical modeling and simulation of electronic, optical or hybrid devices, the interconnect, isolation and 2D or 3D integration; Aspects of materials, fabrication processes and devices, e.g. advanced physical phenomena (quantum mechanical and non-stationary transport phenomena, ballistic transport, and other related aspects); Mechanical or electro-thermal modeling and simulation; DfM. Reliability of materials and devices.
Compact Modeling of Devices and Circuits
Compact/SPICE modeling of electronic, optical, organic, and hybrid devices and their IC implementation and interconnection. Topics include compact/SPICE models and their Verilog-A standardization of the semiconductor devices (including Bio/Med sensors, MEMS, Microwave, RF, High voltage and Power), parameter extraction, compact models for emerging technologies and novel devices, performance evaluation, reliability, variability, and open source benchmarking/implementation methodologies. Modeling of interactions between process, device, and circuit design as well as Foundry/Fabless Interface Strategies.
Memory Devices and Technology
Embedded and stand-alone memories; DRAM, FeRAM, MRAM, ReRAM, PCRAM, Flash, Nanocrystal and single/few-electron memories, Organic memories, NEMS-based devices, Selectors; Novel memory cell concepts and architectures, covering device physics, reliability, process integration and manufacturability issues and including 3D NAND Flash, crosspoint arrays, and 3D systems integration; Devices and concepts for neuromorphic computing, memory-enabled logic and security applications.
Sensor Devices and Technology
Design, fabrication, modeling, reliability, packaging and smart systems integration of actuators (discrete SoC, SiP, or heterogenous 3D integration); MEMS, NEMS, optical, chemical or biological sensors; Display technologies; High-speed imagers; TFTs; Organic and flexible substrate electronics.
Emerging non-CMOS Devices and Technologies
Novel non-CMOS materials, processes and devices, (carbon nanotubes, nanowires and nanoparticles, 2D materials, graphene, metal oxides, etc.) for electronic, optoelectronic, sensor & actuator applications; Reliability and characterization of materials, processes and devices; Molecular and quantum devices; Nanophotonics, plasmonics, spintronics, selfassembling methods; Energy harvesters; High frequency digital and analog devices including THz; New high-mobility channels (strained Si, Ge, SiGe).