The ESSCIRC’2019 conference topics:
OP-Amps and instrumentation amplifiers; CT and DT filters; SC circuits, Comparators; Voltage and current references; High voltage circuits; Nonlinear analog circuits; Digitally assisted analog circuits.
Nyquist-rate and oversampling A/D and D/A converters; Sample-hold circuits; Time-to-digital converters; ADC and DAC calibration/error correction circuits.
RF and mm-Wave
RF/IF building blocks like LNAs, mixers, power amplifiers, IF amplifiers; Power detectors; Subsystems for RF, mm-wave and
Modulators/demodulators; VCOs; PLLs; DLLs; Frequency synthesizers; Frequency dividers; Integrated passive components.
Wireless and Wireline Systems
Receivers/transmitters/transceivers for wireless/wireline systems Gigabit serial links; Clock and data recovery; Equalization;
Advanced modulation systems; Base station and handset applications; TV/radio/satellite receivers and transmitters; Radars.
Sensors, Imager and Biomedical
Sensor subsystems and interfaces; Accelerometers; Temperature sensing; Imaging and smart imaging chips; AMOLED; MEMs subsystems; RF MEMs; Implantable electronic ICs; Biomedical imagers; Bio-MEMs integrated systems; Lab-on-chip; Organic LED and liquid-crystal-display interface circuits; Flat panel and projection display.
Digital, Security and Memory
Techniques for energy efficient and high performance digital circuits; I/O and inter-chip communication; Reconfigurable digital
circuits; Security and encryption circuits; Clocking; Arithmetic building blocks; Memories; Microprocessors; DSPs; Memory
interfacing; Bus interfacing; Many core and multirate ICs; 3D integration.
Energy transducers; Power regulators; DC-DC converters; Energy scavenging circuits; LDOs Boost-buck-converters; LED and gate drivers; Sequencers and supervisors; Green circuits.